What is the difference between slots and sockets

Although Socket M2 contains pins—the same number as used by Socket —Socket M2 is designed to support the integrated dual-channel DDR2 memory controllers that were added to the Athlon 64 and Opteron processor families in Processors designed for Sockets , , and include DDR memory controllers and are not pin compatible with Socket M2.

After introducing the Pentium Pro with its integrated L2 cache, Intel discovered that the physical package it chose was very costly to produce. Intel was looking for a way to easily integrate cache and possibly other components into a processor package, and it came up with a cartridge or board design as the best way to do this.

To accept its new cartridges, Intel designed two types of slots that could be used on motherboards. Slot 2, on the other hand, is a more sophisticated pin slot designed for the Pentium II Xeon and Pentium III Xeon processors, which are primarily for workstations and servers.

Besides the extra pins, the biggest difference between Slot 1 and Slot 2 is the fact that Slot 2 was designed to host up to four-way or more processing in a single board. Slot 1 allows only single or dual processing functionality. Note that Slot 2 is also called SC, which stands for slot connector with pins. Intel later discovered less-expensive ways to integrate L2 cache into the processor core and no longer produces Slot 1 or Slot 2 processors.

Both Slot 1 and Slot 2 processors are now obsolete, and many systems using these processors have been retired or upgraded with socket-based motherboards.

These versions of the Xeon differ from the standard Pentium II and slot-based Pentium III mainly by virtue of having full-core speed L2 cache, and in some versions more of it.

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Supplemental Privacy Statement for California Residents California residents should read our Supplemental privacy statement for California residents in conjunction with this Privacy Notice. The following sections provide details about the major types of processor packaging used on servers.

PGA, which dates back to the IBM processor first introduced in , takes its name from the fact that the chip has a grid-like array of pins on the bottom of the package. A ZIF socket has a lever to allow for easy installation and removal of the chip. As Figure 2. Figure 2. Top and bottom views of the PowerPC processor module, which includes the processor and two external cache chips.

The processor module connects to the system via a PGA socket. Top left and bottom right views of the Athlon MP processor. This processor uses an SPGA connector. Top left and bottom right views of the Xeon DP processor. Depending on the processor, the pins might be in standard rows and columns, as in Figure 2. This design moves the pins closer together and decreases the overall size of the chip when a large number of pins is required.

Several methods have been used to build PGA chips. Older PGA variations had the processor die mounted in a cavity underneath the substrate, with the top surface facing up if you turned the chip upside-down. The die was then wire-bonded to the chip package, with hundreds of tiny gold wires connecting the connections at the edge of the chip with the internal connections in the package.

After the wire bonding, the cavity was sealed with a metal cover. This was an expensive and time-consuming method of producing chips, so less expensive and more efficient packaging methods were designed. This type still plugs in to a PGA socket, but the package itself is dramatically simplified. With FC-PGA, the raw silicon die is mounted facedown on the top of the chip substrate, and instead of wire bonding, the connections are made with tiny solder bumps around the perimeter of the die. The edge is then sealed with a fillet of epoxy.

The Athlon MP chip shown in Figure 2. The heatsink sat on the top of the die, which acted as a pedestal. If you pressed down on one side of the heatsink excessively during the installation process such as when you were attaching the clip , you risked cracking the silicon die and destroying the chip. This was especially a problem as heatsinks became larger and heavier and the force applied by the clip became greater.

Still, these bumpers could compress, and it was too easy to crack the die during heatsink installation. It incorporates an integrated protective metal cap called a heat spreader that sits on top of the die, enabling larger and heavier heatsinks to be installed without any potential damage to the processor core.

AMD has returned to the heat spreader design with its Opteron processors. AMD Opteron, Intel Xeon, and Intel Pentium 4 processors also use various types of heatsink supports rather than fastening the heatsink directly to the processor socket. This helps prevent damage to the processor.

In addition to changes in the socket and arrangement of the processor core, PGA-based designs have also used various materials for the processor chip substrate. Ceramic material was common for several years, but more recent designs have used lighter-weight plastics, including some organic plastics.

Starting in the late s, some processors began to use a different type of connection known as a BGA. BGA chips use small solder balls to make the connection to the socket. Typically, BGA is used when chips are soldered into place, such as on a processor module, as shown in Figure 2.

In socketed form, LGA allows for much greater clamping forces and therefore greater stability and improved thermal transfer better cooling than PGA. Top left and bottom right views of the Pentium D processor. This processor uses an LGA design. The processor assembly is then plugged in to a slot in the server. Intel used cartridge- or board-based packaging for several of its server-class processors from through This packaging was called single-edge contact cartridge SECC , and it consisted of the CPU and separate L2 cache chips mounted on a circuit board that looked similar to an oversized memory module and that plugged in to a slot.

In some cases, the boards were covered with plastic cartridge covers. Building the processor into a cartridge was a cost-effective method for integrating L2 cache into the processor before it was feasible to include the cache directly inside the processor die.

Slot 1 was also known as Slot , for the pins in the slot connector. The connector used two different-sized sections to prevent incorrect insertion of the cartridge see Figure 2. A rigid or folding frame known as a processor-retention mechanism was used to support the processor. Slot 1 supported single or two-way processor configurations.

Slot 2 supported up to four-way processing. Note that Slot 2 was also called SC, which stands for slot connector with pins see Figure 2. Slot 2 SC connector dimensions and pin layout. Intel later discovered less-expensive ways to integrate L2 cache into the processor core, and it no longer produces Slot 1 or Slot 2 processors.

Both Slot 1 and Slot 2 processors are now obsolete, and most systems using these processors have been retired or upgraded with socket-based motherboards. Originally, the SECC package wrapped around three sides of the processor cartridge assembly. However, this design made cooling difficult and raised the cost of the processor.

The rectangular chips on the right side of the rear view are the cache memory chips. Note the large thermal plate used to aid in dissipating the heat from this processor. A passive or active heatsink was attached to the thermal plate. The additional pins allow for additional signals needed by multiple processors. When the Socket 1 specification used by the first processors was created, manufacturers realized that if users were going to upgrade processors, they had to make the process easier.

The socket manufacturers found that pounds of insertion force is required to install a chip in a standard pin screw Socket 1 motherboard. With this much force involved, you could easily damage either the chip or the socket during removal or reinstallation. Therefore, some motherboard manufacturers began using low insertion force LIF sockets, which required only 60 pounds of insertion force for a pin chip.

But pressing down on the motherboard with 60 to pounds of force can still crack the board if it is not supported properly. Slot or socket is the physical connection used to connect a device CPU to the system board. The type of slot or socket supplied by the system board for the processor must match that required by the processor.

This is a socket from a Pentium 4 board. You basically just drop the CPU into the socket lock it with the locking arm. Then all you have left is to install the cooler and set up the clock speed. It looks a lot like an expansion slot, but is not generally located in the same area on the board.

Also once you get the CPU into it with all the cooling it is much bulkier then what you would usually see in any expansion slot. Search web. C Programming. Computer Fundamentals. Information Technology. Data structures.